Patrick Lam

City:

Hong Kong

Country:

China

Published Applications:

Last publication date:

2010-11-18

Recent patent applications by Lam Patrick

Patrick Lam from Hong Kong, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material

InventorID:

3693174 ⎘