Mark Adam Bachman

City:

Sinking Spring, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2010-12-23

Top Assignees for applications by Mark Adam Bachman

The entities that hold a legal rights for patent applications filed by inventor Bachman Mark Adam:

Agere Systems Inc. 8 Allentown, PA United States

Recent patent applications by Bachman Mark Adam

Mark Adam Bachman from Sinking Spring, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-12-23

US20100319967A1

Electricity

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

#2 | 2009-12-03

US20090298286A1

Electricity

Method of making electronic entities

#3 | 2009-11-05

US20090273078A1

Electricity

Electronic packages

#4 | 2009-03-19

US20090072393A1

Electricity

Structure and method for fabricating flip chip devices

#5 | 2008-02-12

US10741155

Structure and method for bonding to copper interconnect structures

#6 | 2007-09-20

US20070216034A1

Electricity

Low thermal resistance assembly for flip chip applications

#7 | 2006-03-30

US20060066327A1

Electricity

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

#8 | 2005-03-31

US20050067709A1

Electricity

Reinforced bond pad

InventorID:

3716699 ⎘