Shelburne, Vermont
United States
139
2019-12-19
The entities that hold a legal rights for patent applications filed by inventor Jaffe Mark D.:
Mark D. Jaffe from Shelburne, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Photodiode structures
#2 | 2019-11-21Photodiode structures
#3 | 2019-08-29Backside contact to a final substrate
#4 | 2019-05-09Semiconductor structure with airgap
#5 | 2019-04-25Shielding structures between optical waveguides
#6 | 2019-01-17Photodiode structures
#7 | 2018-12-25Transistor with improved channel mobility
#8 | 2018-10-04Backside contact to a final substrate
#9 | 2018-09-20Photodiode structures
#10 | 2018-09-06Switchable filters and design structures
#11 | 2018-09-06Photodiode structures
#12 | 2018-03-29Backside device contact
#13 | 2018-03-29Backside device contact
#14 | 2018-03-29Backside device contact
#15 | 2018-03-15Photodiode structures
#16 | 2018-03-08Backside contact to a final substrate
#17 | 2018-03-08Backside contact to a final substrate
#18 | 2018-03-08Semiconductor structure with airgap
#19 | 2018-02-08Backside contact to a final substrate
#20 | 2018-01-04Device layer transfer with a preserved handle wafer section
#21 | 2017-12-21Switchable filters and design structures
#22 | 2017-12-21Switchable filters and design structures
#23 | 2017-12-21Backside integration of RF filters for RF front end modules and design structure
#24 | 2017-11-16Air gap over transistor gate and related method
#25 | 2017-11-16Air gap over transistor gate and related method
#26 | 2017-06-15Semiconductor structure with airgap
#27 | 2017-05-04Photodiode structures
#28 | 2017-05-04Photodiode structures
#29 | 2017-01-12Backside contact to a final substrate
#30 | 2017-01-12Backside contact to a final substrate
#31 | 2016-12-22Backside device contact
#32 | 2016-12-22Backside contact to final substrate
#33 | 2016-10-20On chip antenna with opening
#34 | 2016-09-27Backside device contact
#35 | 2016-07-21Semiconductor structure with airgap
#36 | 2016-03-31Semiconductor structure with airgap
#37 | 2016-03-17Photodiode structures
#38 | 2016-03-10Switchable filters and design structures
#39 | 2016-03-10Semiconductor structure with airgap
#40 | 2015-12-24Switchable filters and design structures
#41 | 2015-11-26Silicon waveguide on bulk silicon substrate and methods of forming
#42 | 2015-11-05Switchable filters and design structures
#43 | 2015-08-27Tunable filter structures and design structures
#44 | 2015-08-27Backside integration of RF filters for RF front end modules and design structure
#45 | 2015-07-09Shielding structures between optical waveguides
#46 | 2015-04-30Encapsulated sensors
#47 | 2015-03-12High linearity SOI wafer for low-distortion circuit applications
#48 | 2015-02-12Switchable filters and design structures
#49 | 2015-02-05SEGMENTED GUARD RING STRUCTURES WITH ELECTRICALLY INSULATED GAP STRUCTURES AND DESIGN STRUCTURES THEREOF
#50 | 2015-01-01High linearity SOI wafer for low-distortion circuit applications
#51 | 2015-01-01Thin body switch transistor
#52 | 2014-10-30Vertically curved waveguide
#53 | 2014-10-30Vertical bend waveguide coupler for photonics applications
#54 | 2014-10-16COMPENSATION FOR A CHARGE IN A SILICON SUBSTRATE
#55 | 2014-09-04Segmented guard ring structures with electrically insulated gap structures and design structures thereof
#56 | 2014-05-15Compensation for a charge in a silicon substrate
#57 | 2014-05-08High resistivity silicon-on-insulator substrate and method of forming
#58 | 2013-10-03Discontinuous guard ring
#59 | 2013-08-22Method of manufacturing switchable filters
#60 | 2013-08-01Silicon-on-insulator substrate and method of forming
#61 | 2013-07-25Method of manufacturing switching filters and design structures
#62 | 2013-07-25Backside integration of RF filters for RF front end modules and design structure
#63 | 2013-07-18Diffusion barrier for oppositely doped portions of gate conductor
#64 | 2013-07-11Double-sided integrated circuit chips
#65 | 2013-07-04Method of manufacturing switchable filters
#66 | 2013-07-04High resistivity silicon-on-insulator substrate and method of forming
#67 | 2013-06-27Isolation structures for global shutter imager pixel, methods of manufacture and design structures
#68 | 2013-06-27SAW FILTER HAVING PLANAR BARRIER LAYER AND METHOD OF MAKING
#69 | 2013-06-13Method of manufacturing a film bulk acoustic resonator with a loading element
#70 | 2013-05-09Tunable filter structures and design structures
#71 | 2013-01-31Passivated through wafer vias in low-doped semiconductor substrates
#72 | 2013-01-17Saw filter having planar barrier layer and method of making
#73 | 2012-05-17CMOS imager photodiode with enhanced capacitance
#74 | 2012-05-03Anti-blooming pixel sensor cell with active neutral density filter, methods of manufacture, and design structure
#75 | 2012-05-01Self-dicing chips using through silicon vias
#76 | 2012-04-26Bond pad for wafer and package for CMOS imager
#77 | 2012-04-05Isolation structures for global shutter imager pixel, methods of manufacture and design structures
#78 | 2012-02-16Methods for enhancing quality of pixel sensor image frames for global shutter imaging
#79 | 2012-01-05ISOLATION WITH OFFSET DEEP WELL IMPLANTS
#80 | 2011-11-17Interface device with integrated solar cell(S) for power collection
#81 | 2011-06-02Delamination and crack resistant image sensor structures and methods
#82 | 2010-11-18Isolation with offset deep well implants
#83 | 2010-09-30Variable dynamic range pixel sensor cell, design structure and method
#84 | 2010-09-16Pixel sensor cell including light shield
#85 | 2010-07-01Random personalization of chips during fabrication
#86 | 2010-06-03Methods of forming silicide strapping in imager transfer gate device
#87 | 2010-04-22High efficiency CMOS image sensor pixel employing dynamic voltage supply
#88 | 2010-04-08CMOS imager photodiode with enhanced capacitance
#89 | 2010-02-18Bond pad for wafer and package for CMOS imager
#90 | 2009-12-10Delamination and crack resistant image sensor structures and methods
#91 | 2009-10-29Methods for enhancing quality of pixel sensor image frames for global shutter imaging
#92 | 2009-09-24Image sensor monitor structure in scribe area
#93 | 2009-09-24High efficiency CMOS image sensor pixel employing dynamic voltage supply
#94 | 2009-09-10Image sensor including spatially different active and dark pixel interconnect patterns
#95 | 2009-05-14Stacked imager package
#96 | 2009-04-02Three dimensional vertical E-fuse structures and methods of manufacturing the same
#97 | 2009-02-19Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package
#98 | 2009-01-01CHARGE CARRIER BARRIER FOR IMAGE SENSOR
#99 | 2008-12-04Pixel sensor cell having a pinning layer surrounding collection well regions for collecting electrons and holes
#100 | 2008-11-06Method of forming a pixel sensor cell for collecting electrons and holes
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