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Inventor profile of:

Sangwon OH

City:

Daejeon

Country:

South Korea

Published Applications:

5

Last publication date:

2024-02-15

Top Assignees for applications by Sangwon OH

The entities that hold a legal rights for patent applications filed by inventor OH Sangwon:

  • Electronics and Telecommunications Research Institute 4 Daejeon, South Korea

Recent patent applications by OH Sangwon

Sangwon OH from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15
US20240053208A1
Physics

APPARATUS FOR MEASURING TEMPERATURE USING DIAMOND NITROGEN-VACANCY CENTER SENSOR AND MANUFACTURING METHOD THEREFOR

#2 | 2014-10-30
US20140317918A1
Electricity

Composition and methods of forming solder bump and flip chip using the same

#3 | 2014-10-30
US20140317915A1
Electricity

Composition and methods of forming solder bump and flip chip using the same

#4 | 2013-08-08
US20130200135A1
Performing operations; transporting

Composition and methods of forming solder bump and flip chip using the same

#5 | 2010-01-14
US20100006625A1
Electricity

Composition and methods of forming solder bump and flip chip using the same

InventorID:

372557 ⎘

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