Scott E. Moore

City:

Nampa, Idaho

Country:

United States

Published Applications:

Last publication date:

2010-02-11

Top Assignees for applications by Scott E. Moore

The entities that hold a legal rights for patent applications filed by inventor Moore Scott E.:

Scott E. Moore from Nampa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for selectively removing conductive material from a microelectronic substrate

Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Methods and apparatuses for heating semiconductor wafers

Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate

InventorID:

3731565 ⎘