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Inventor profile of:

Eric W. Boyd

City:

San Clemente, California

Country:

United States

Published Applications:

1

Last publication date:

2010-01-14

Recent patent applications by Boyd Eric W.

Eric W. Boyd from San Clemente, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-01-14

US20100009499A1

STACKED MICROELECTRONIC LAYER AND MODULE WITH THREE-AXIS CHANNEL T-CONNECTS

InventorID:

3734120 ⎘