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Inventor profile of:

Alan E. Wang

City:

Gibsonia, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2010-01-21

Top Assignees for applications by Alan E. Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Alan E.:

PPG INDUSTRIES OHIO, INC. 17 Cleveland, OH United States

Recent patent applications by Wang Alan E.

Alan E. Wang from Gibsonia, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-01-21

US20100012357A1

Electricity

Printed circuit board with improved via design

#2 | 2009-04-23

US20090101274A1

Electricity

Method of forming a circuit board with improved via design

#3 | 2008-01-31

US20080026602A1

Electricity

Printed Circuit Board With Improved Via Design

#4 | 2008-01-31

US20080022523A1

Electricity

Method of forming a printed circuit board with improved via design

#5 | 2007-06-12

US10291876

Process for fabricating a multi layer circuit assembly

#6 | 2007-05-17

US20070111561A1

Electricity

Circuit board and method of manufacture thereof

#7 | 2007-04-19

US20070087118A1

Chemistry; metallurgy

METHOD AND COMPOSITIONS WITH NONEXPANDABLE OR EXPANDED BEADS FOR COATING CERAMIC SUBSTRATES

#8 | 2007-01-25

US20070021045A1

Performing operations; transporting

Polyurethane Urea Polishing Pad with Window

#9 | 2007-01-11

US20070010169A1

Performing operations; transporting

Polishing pad with window for planarization

#10 | 2007-01-02

US10465486

Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates

#11 | 2006-11-16

US20060254706A1

Performing operations; transporting

Polyurethane urea polishing pad

#12 | 2006-10-19

US20060235111A1

Electricity

METHOD AND COMPOSITIONS FOR APPLYING MULTIPLE OVERLYING ORGANIC PIGMENTED DECORATIONS ON CERAMIC SUBSTRATES

#13 | 2006-09-28

US20060213685A1

Electricity

Single or multi-layer printed circuit board with improved edge via design

#14 | 2006-08-29

US10317982

Polishing pad

#15 | 2006-08-17

US20060183412A1

Performing operations; transporting

Polishing pad

#16 | 2006-04-27

US20060089095A1

Performing operations; transporting

Polyurethane urea polishing pad

#17 | 2006-04-27

US20060089094A1

Performing operations; transporting

Polyurethane urea polishing pad

#18 | 2006-04-27

US20060089093A1

Performing operations; transporting

Polyurethane urea polishing pad

#19 | 2006-04-13

US20060075633A1

Electricity

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

#20 | 2006-02-21

US10184192

Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions

#21 | 2006-01-12

US20060005995A1

Electricity

Method of making a circuit board

#22 | 2005-10-04

US10184387

Process for creating vias for circuit assemblies

#23 | 2005-06-14

US10664860

Polishing pad for planarization

#24 | 2005-06-09

US20050124196A1

Electricity

Single or multi-layer printed circuit board with improved via design

#25 | 2005-02-10

US20050032464A1

Performing operations; transporting

Polishing pad having edge surface treatment

#26 | 2005-02-03

US20050025891A1

Chemistry; metallurgy

Method and compositions for coating ceramic substrates

#27 | 2005-01-18

US10227768

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

#28 | 2005-01-13

US20050006138A1

Electricity

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

InventorID:

3736642 ⎘