Jun Sakano

City:

Gunma

Country:

Japan

Published Applications:

Last publication date:

2010-01-21

Top Assignees for applications by Jun Sakano

The entities that hold a legal rights for patent applications filed by inventor Sakano Jun:

Jun Sakano from Gunma, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Metal core circuit element mounting board

Circuit device with conductive patterns separated by insulating resin-filled grooves

Circuit device and manufacturing method thereof

Circuit device and method of manufacture thereof

InventorID:

3736644 ⎘