Kazuyoshi Tendou

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2010-01-21

Top Assignees for applications by Kazuyoshi Tendou

The entities that hold a legal rights for patent applications filed by inventor Tendou Kazuyoshi:

Kazuyoshi Tendou from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same

Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler

Epoxy Resin Molding Material for Sealing, and Electronic Component Device

Epoxy resin molding material for sealing and electronic component

InventorID:

3738136 ⎘