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Inventor profile of:

Damian Baumann

City:

Muri

Country:

Switzerland

Published Applications:

1

Last publication date:

2010-01-28

Recent patent applications by Baumann Damian

Damian Baumann from Muri, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-01-28

US20100019018A1

Performing operations; transporting

Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering Flux

InventorID:

3742270 ⎘