Fishkill, New York
United States
4
2010-01-28
The entities that hold a legal rights for patent applications filed by inventor Wei Xiaojin:
Xiaojin Wei from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Segmentation of a die stack for 3D packaging thermal management
#2 | 2009-11-19Semiconductor package structures having liquid coolers integrated with first level chip package modules
#3 | 2009-07-16Local area semiconductor cooling system
#4 | 2009-07-09Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging
3742550 ⎘