Eugene, Oregon
United States
19
2018-04-12
The entities that hold a legal rights for patent applications filed by inventor Hellekson Ronald A.:
Ronald A. Hellekson from Eugene, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Laminate manifolds for mesoscale fluidic systems
#2 | 2017-04-06Laminate manifolds for mesoscale fluidic systems
#3 | 2014-05-27Print head array testing
#4 | 2013-08-08Print head die
#5 | 2010-07-15Pixel well electrodes
#6 | 2010-04-15Mandrel
#7 | 2009-10-15Bonded structures formed by plasma enhanced bonding
#8 | 2009-02-05Pixel well electrode
#9 | 2009-02-05Pixel well electrodes
#10 | 2009-01-29DISPLAY APPARATUS WITH RESISTOR MULTIPLEXER
#11 | 2008-10-30THIN FILM TRANSISTOR
#12 | 2007-02-22System and method for calculating a shift value between pattern instances
#13 | 2006-09-05Mechanism to aid optical beam focusing on optical disc
#14 | 2006-05-04Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
#15 | 2006-05-04Ink-jet printing of coupling agents for trace or circuit deposition templating
#16 | 2006-02-16Systems and methods for wafer bonding by localized induction heating
#17 | 2005-06-07Method of forming a through-substrate interconnect
#18 | 2005-05-12Method of forming a through-substrate interconnect
#19 | 2005-03-03Die carrier with fluid chamber
374280 ⎘