Tokyo
Japan
5
2010-02-11
The entities that hold a legal rights for patent applications filed by inventor Inoue Hirobumi:
Hirobumi Inoue from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
CIRCUIT MODULE
#2 | 2007-02-08Analysis method and analysis apparatus of designing transmission lines of an integrated circuit packaging board
#3 | 2006-05-18Wiring board having connecting wiring between electrode plane and connecting pad
#4 | 2006-03-16Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
#5 | 2006-02-14Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
3750128 ⎘