Hideki Higashitani

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2010-02-11

Top Assignees for applications by Hideki Higashitani

The entities that hold a legal rights for patent applications filed by inventor Higashitani Hideki:

Hideki Higashitani from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate

InventorID:

3750132 ⎘