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Inventor profile of:

Neyoshi Ishida

City:

Kanagawa

Country:

Japan

Published Applications:

1

Last publication date:

2010-02-11

Recent patent applications by Ishida Neyoshi

Neyoshi Ishida from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-02-11

US20100035057A1

Chemistry; metallurgy

PRIMER COMPOSITION AND ADHESIVE SUBSTRATE

InventorID:

3752224 ⎘