Daisuke Nakamata

City:

Chikuma

Country:

Japan

Published Applications:

Last publication date:

2010-02-18

Top Assignees for applications by Daisuke Nakamata

The entities that hold a legal rights for patent applications filed by inventor Nakamata Daisuke:

Daisuke Nakamata from Chikuma, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Slicing method

Slicing method and method for manufacturing epitaxial wafer

Slicing method

InventorID:

3754603 ⎘