Inventor profile of:

Vivian Ryan

City:

Hampton, New Jersey

Country:

United States

Published Applications:

13

Last publication date:

2010-02-25

Top Assignees for applications by Vivian Ryan

The entities that hold a legal rights for patent applications filed by inventor Ryan Vivian:

Recent patent applications by Ryan Vivian

Vivian Ryan from Hampton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-02-25
US20100045326A1
Physics

Thermal monitoring and management of integrated circuits

#2 | 2008-01-31
US20080026508A1
Electricity

Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink

#3 | 2008-01-31
US20080026503A1
Physics

On-chip sensor array for temperature management in integrated circuits

#4 | 2007-06-14
US20070134903A1
Electricity

Integrated circuit having bond pad with improved thermal and mechanical properties

#5 | 2007-03-29
US20070069368A1
Electricity

Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink

#6 | 2006-12-28
US20060289988A1
Electricity

Integrated circuit with heat conducting structures for localized thermal control

#7 | 2006-07-20
US20060157871A1
Electricity

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

#8 | 2006-05-04
US20060091480A1
Electricity

Lateral double diffused MOS transistors

#9 | 2006-02-23
US20060038294A1
Electricity

Metallization performance in electronic devices

#10 | 2005-12-29
US20050287952A1
Electricity

Heat sink formed of multiple metal layers on backside of integrated circuit die

#11 | 2005-11-10
US20050248033A1
Electricity

Semiconductor device having a dummy conductive via and a method of manufacture therefor

#12 | 2005-05-05
US20050092987A1
Electricity

Methods and apparatus for the detection of damaged regions on dielectric film or other portions of a die

#13 | 2005-03-31
US20050067678A1
Electricity

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

InventorID:

3760526 ⎘