Lagrangeville, New York
United States
11
2010-03-11
The entities that hold a legal rights for patent applications filed by inventor Griffith Jonathan H.:
Jonathan H. Griffith from Lagrangeville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
#2 | 2009-06-25Forming robust solder interconnect structures by reducing effects of seed layer underetching
#3 | 2008-07-03Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
#4 | 2006-11-09Device with area array pads for test probing
#5 | 2006-01-12Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#6 | 2005-11-03Barrier for interconnect and method
#7 | 2005-09-22Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#8 | 2005-08-04DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#9 | 2005-05-19STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
#10 | 2005-05-19Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
#11 | 2005-02-03ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER
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