Nagoya
Japan
20
2014-08-07
The entities that hold a legal rights for patent applications filed by inventor MAEDA Shinnosuke:
Shinnosuke MAEDA from Nagoya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Multilayer wiring substrate
#2 | 2013-06-27Method of manufacturing multi-layer wiring board
#3 | 2012-12-13Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
#4 | 2012-06-21Multilayer wiring substrate and method of manufacturing the same
#5 | 2012-06-14Method of manufacturing multilayer wiring substrate
#6 | 2012-05-10Multilayer wiring substrate
#7 | 2012-05-03Method of manufacturing multilayer wiring substrate
#8 | 2012-02-02Multilayer wiring substrate
#9 | 2012-01-26Multilayer wiring board and manufacturing method thereof
#10 | 2011-11-24Multilayer wiring substrate
#11 | 2011-09-29Multilayer wiring substrate
#12 | 2011-09-01Multilayer wiring substrate and method of manufacturing the same
#13 | 2011-09-01Multilayered wiring board and method of manufacturing the same
#14 | 2011-08-18Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
#15 | 2011-08-18Multilayer wiring substrate, and method of manufacturing the same
#16 | 2011-06-30Multilayered wiring substrate
#17 | 2011-06-30Method of manufacturing multilayer wiring substrate
#18 | 2010-08-19Wiring board assembly and manufacturing method thereof
#19 | 2010-08-19Multilayer wiring substrate and method for manufacturing the same
#20 | 2010-04-01Wiring substrate with reinforcement
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