Boise, Idaho
United States
19
2010-06-17
The entities that hold a legal rights for patent applications filed by inventor Mess Leonard E.:
Leonard E. Mess from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
#2 | 2010-04-01Semiconductor device assemblies, electronic devices including the same and assembly methods
#3 | 2009-11-19Semiconductor device and method of fabrication thereof
#4 | 2008-02-21Stackable ceramic FBGA for high thermal applications
#5 | 2007-08-28Stacked mass storage flash memory package
#6 | 2007-03-22Method of forming a semiconductor device
#7 | 2006-03-23Assembly for stacked BGA packages
#8 | 2006-03-09Module assembly and method for stacked BGA packages
#9 | 2006-03-09Module assembly for stacked BGA packages
#10 | 2005-07-07Alignment and orientation features for a semiconductor package
#11 | 2005-07-07Stackable ceramic FBGA for high thermal applications
#12 | 2005-05-31Stacked mass storage flash memory package
#13 | 2005-05-26Module assembly and method for stacked BGA packages
#14 | 2005-04-28Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
#15 | 2005-03-22Alignment and orientation features for a semiconductor package
#16 | 2005-03-08System for electronically coupling a device to an electrical apparatus
#17 | 2005-02-22Stackable ceramic FBGA for high thermal applications
#18 | 2005-02-10Stacked mass storage flash memory package
#19 | 2005-01-04Module assembly for stacked BGA packages
3772080 ⎘