Nick-Seth Smith

City:

Berkeley Heights, New Jersey

Country:

United States

Published Applications:

Last publication date:

2010-04-08

Top Assignees for applications by Nick-Seth Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Nick-Seth:

MMF Systems, Inc. 1 New York, NY United States

Recent patent applications by Smith Nick-Seth

Nick-Seth Smith from Berkeley Heights, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-04-08

US20100086113A1

Electricity

SKIN CURED PTFE WIRE AND CABLE

#2 | 2009-07-14

US9664969

System and method for automatically routing and storing coded information and displaying an interaction device

InventorID:

3777207 ⎘