Hideki KOJIMA

City:

Niigata

Country:

Japan

Published Applications:

Last publication date:

2010-06-17

Top Assignees for applications by Hideki KOJIMA

The entities that hold a legal rights for patent applications filed by inventor KOJIMA Hideki:

Hideki KOJIMA from Niigata, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor wafer and a method of separating the same

Piezoelectric body module and manufacturing method therefor

InventorID:

3789296 ⎘