John J. Hackenberg

City:

Austin, Texas

Country:

United States

Published Applications:

Last publication date:

2010-05-27

Top Assignees for applications by John J. Hackenberg

The entities that hold a legal rights for patent applications filed by inventor Hackenberg John J.:

John J. Hackenberg from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of forming a semiconductor layer

Method to improve source/drain parasitics in vertical devices

STI stressor integration for minimal phosphoric exposure and divot-free topography

Stressor integration and method thereof

Method of forming a semiconductor isolation trench

Electronic device including a trench field isolation region and a process for forming the same

InventorID:

3793373 ⎘