Austin, Texas
United States
5
2010-07-08
The entities that hold a legal rights for patent applications filed by inventor Corbin John S.:
John S. Corbin from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of making a land-grid-array (LGA) interposer
#2 | 2008-03-27IC chip package having automated tolerance compensation
#3 | 2008-01-31Heatsink apparatus for applying a specified compressive force to an integrated circuit device
#4 | 2007-03-08Topography compensating land grid array interposer
#5 | 2005-12-22Packaging for enhanced thermal and structural performance of electronic chip modules
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