Daisuke Kamiya

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2024-03-07

Top Assignees for applications by Daisuke Kamiya

The entities that hold a legal rights for patent applications filed by inventor Kamiya Daisuke:

Daisuke Kamiya from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF PRODUCING OXIDIZED CELLULOSE AND NANOCELLULOSE

PRODUCTION METHOD OF NANOCELLULOSE-CONTAINING COMPOSITION

RESIN COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND RESIN

FUNGICIDE FOR AGRICULTURAL AND HORTICULTURAL USE CONTAINING INORGANIC COPPER COMPOUND AS ACTIVE INGREDIENT

Active energy radiation hardenable skin plaster composition and skin plaster

Radiation-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets

Pressure-sensitive adhesive curable with active energy ray and pressure-sensitive adhesive sheet

InventorID:

3810509 ⎘