Young-Kun Jee

City:

Daejeon

Country:

Korea (South)

Published Applications:

Last publication date:

2010-09-23

Recent patent applications by Jee Young-Kun

Young-Kun Jee from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using Thereof

Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture

InventorID:

3840160 ⎘