Eagle, Idaho
United States
77
2024-10-10
The entities that hold a legal rights for patent applications filed by inventor Watkins Charles M.:
Charles M. Watkins from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION
#2 | 2023-12-28MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION
#3 | 2023-08-31Light emitting diodes with enhanced thermal sinking and associated methods of operation
#4 | 2022-05-19Light emitting diodes with enhanced thermal sinking and associated methods of operation
#5 | 2021-11-04Microelectronic workpiece processing systems and associated methods of color correction
#6 | 2019-11-07Light emitting diodes with enhanced thermal sinking and associated methods of operation
#7 | 2019-09-26Microelectronic workpiece processing systems and associated methods of color correction
#8 | 2018-10-25SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
#9 | 2017-11-02Light emitting diodes with enhanced thermal sinking and associated methods of operation
#10 | 2017-04-13LIGHT EMITTING DEVICES WITH BUILT-IN CHROMATICITY CONVERSION AND METHODS OF MANUFACTURING
#11 | 2017-01-12Systems and methods for forming apertures in microfeature workpieces
#12 | 2016-07-07Light emitting diodes with enhanced thermal sinking and associated methods of operation
#13 | 2016-01-28Light emitting devices with built-in chromaticity conversion and methods of manufacturing
#14 | 2015-01-01Light emitting devices with built-in chromaticity conversion and methods of manufacturing
#15 | 2014-08-28Microelectronic workpiece processing systems and associated methods of color correction
#16 | 2014-07-31Systems and methods for forming apertures in microfeature workpieces
#17 | 2014-01-16System and methods for forming apertures in microfeature workpieces
#18 | 2013-11-07Through-wafer interconnects for photoimager and memory wafers
#19 | 2013-07-11Light emitting diodes with enhanced thermal sinking and associated methods of operation
#20 | 2013-07-04Method for forming a light conversion material
#21 | 2013-05-30Coated color-converting particles and associated devices, systems, and methods
#22 | 2013-01-03Light emitting diodes and methods for manufacturing light emitting diodes
#23 | 2012-11-29Light emitting devices with built-in chromaticity conversion and methods of manufacturing
#24 | 2011-09-29Through-wafer interconnects for photoimager and memory wafers
#25 | 2011-09-22Light emitting diodes with enhanced thermal sinking and associated methods of operation
#26 | 2011-09-22Light emitting diodes and methods for manufacturing light emitting diodes
#27 | 2011-09-08Method for forming a light conversion material
#28 | 2011-09-08Microelectronic workpiece processing systems and associated methods of color correction
#29 | 2011-04-21Packaged microelectronic imagers and methods of packaging microelectronic imagers
#30 | 2011-03-31Method of forming vias in semiconductor substrates and resulting structures
#31 | 2010-07-08Through-wafer interconnects for photoimager and memory wafers
#32 | 2009-06-18Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#33 | 2008-05-15Through-wafer interconnects for photoimager and memory wafers
#34 | 2008-01-24Packaged microelectronic imagers and methods of packaging microelectronic imagers
#35 | 2007-11-15Method of forming vias in semiconductor substrates and resulting structures
#36 | 2007-08-23Methods of redistributing bondpad locations on an integrated circuit
#37 | 2007-07-26Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#38 | 2007-06-14METHODS AND APPARATUSES FOR RELEASABLY ATTACHING MICROFEATURE WORKPIECES TO SUPPORT MEMBERS
#39 | 2007-03-22Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#40 | 2007-03-01Microfeature workpieces, carriers, and associated methods
#41 | 2006-11-23Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#42 | 2006-11-23Microelectronic imagers and methods of packaging microelectronic imagers
#43 | 2006-11-16Systems and methods for testing microfeature devices
#44 | 2006-11-16Methods of packaging and testing microelectronic imaging devices
#45 | 2006-11-02Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#46 | 2006-10-05Integrated circuit and methods of redistributing bondpad locations
#47 | 2006-09-28Microelectronics devices, having vias, and packaged microelectronic devices having vias
#48 | 2006-09-28Integrated circuit and methods of redistributing bondpad locations
#49 | 2006-09-21Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts
#50 | 2006-09-14Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated
#51 | 2006-09-14Methods for packing microfeature devices and microfeature devices formed by such methods
#52 | 2006-08-31Systems and methods for forming apertures in microfeature workpieces
#53 | 2006-08-24Systems and methods for forming apertures in microfeature workpieces
#54 | 2006-08-10Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
#55 | 2006-07-27Methods and apparatus for releasably attaching microfeature workpieces to support members
#56 | 2006-06-29Method of testing using compliant contact structures, contactor cards and test system
#57 | 2006-06-22Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same
#58 | 2006-06-15Compliant contact structure
#59 | 2006-06-01Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
#60 | 2006-06-01Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material
#61 | 2006-03-02Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
#62 | 2006-03-02Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#63 | 2006-03-02Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
#64 | 2006-03-02Methods for packaging microfeature devices and microfeature devices formed by such methods
#65 | 2006-03-02Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
#66 | 2006-02-02Integrated circuit and methods of redistributing bondpad locations
#67 | 2006-01-19Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#68 | 2005-12-29Packaged microelectronic imagers and methods of packaging microelectronic imagers
#69 | 2005-12-15Microelectronic imagers and methods of packaging microelectronic imagers
#70 | 2005-12-08Systems and methods for testing microelectronic imagers and microfeature devices
#71 | 2005-11-17Apparatus for supporting wafers for die singulation and subsequent handling and in-process wafer structure
#72 | 2005-11-10Systems and methods for forming apertures in microfeature workpieces
#73 | 2005-09-15Method of forming compliant contact structures
#74 | 2005-09-01Electrical contacts with dielectric cores
#75 | 2005-05-19Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#76 | 2005-04-14Compliant contract structures, contactor cards and test system including same
#77 | 2005-03-24Method and apparatus for supporting wafers for die singulation and subsequent handling
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