Jay S. Chey

City:

Ossining, New York

Country:

United States

Published Applications:

Last publication date:

2009-01-01

Recent patent applications by Chey Jay S.

Jay S. Chey from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of Creating Molds of Variable Solder Volumes for Flip Attach

Methods of Creating Molds of Variable Solder Volumes for Flip Attach

InventorID:

3842846 ⎘