Vancouver
Canada
122
2023-09-28
The entities that hold a legal rights for patent applications filed by inventor Tischler Michael A.:
Michael A. Tischler from Vancouver, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
LIGHTING SYSTEMS INCORPORATING CONNECTIONS FOR SIGNAL AND POWER TRANSMISSION
#2 | 2022-06-02Lighting systems incorporating connections for signal and power transmission
#3 | 2022-03-15Lighting systems incorporating connections for signal and power transmission
#4 | 2022-01-13Lighting systems incorporating connections for signal and power transmission
#5 | 2021-09-23ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
#6 | 2021-08-05Sealed and sealable scalable lighting systems incorporating flexible light sheets and related methods
#7 | 2021-07-22High efficiency LEDs and LED lamps
#8 | 2021-01-14Light-emitting dies incorporating wavelength-conversion materials and related methods
#9 | 2020-12-17Lighting systems incorporating connections for signal and power transmission
#10 | 2020-10-29Electronic devices with yielding substrates
#11 | 2020-08-20Wiring boards for array-based electronic devices
#12 | 2020-08-18Lighting systems incorporating connections for signal and power transmission
#13 | 2020-05-21Light-emitting dies incorporating wavelength-conversion materials and related methods
#14 | 2020-05-14Lighting systems incorporating connections for signal and power transmission
#15 | 2019-11-14Lighting systems incorporating connections for signal and power transmission
#16 | 2019-10-17High efficiency LEDs and LED lamps
#17 | 2019-08-01Light-emitting dies incorporating wavelength-conversion materials and related methods
#18 | 2019-07-09Lighting systems incorporating connections for signal and power transmission
#19 | 2019-05-16Sealed and sealable scalable lighting systems incorporating flexible light sheets and related methods
#20 | 2018-12-27Electronic devices with yielding substrates
#21 | 2018-12-27LED lighting system incorporating folded light sheets
#22 | 2018-12-04Programmable control elements for illumination systems
#23 | 2018-11-20Methods for adjusting the light output of illumination systems
#24 | 2018-10-04High efficiency LEDs and LED lamps
#25 | 2018-08-23Light-emitting dies incorporating wavelength-conversion materials and related methods
#26 | 2018-06-21Sealed and sealable lighting systems incorporating flexible light sheets and related methods
#27 | 2018-03-15Sealed and sealable scalable lighting systems incorporating flexible light sheets and related methods
#28 | 2017-12-14High efficiency LEDs and LED lamps
#29 | 2017-10-26Light-emitting dies incorporating wavelength-conversion materials and related methods
#30 | 2017-04-06High efficiency LEDs and LED lamps
#31 | 2017-03-02Wiring boards for array-based electronic devices
#32 | 2017-03-02Wiring boards for array-based electronic devices
#33 | 2017-02-23Sealed and sealable lighting systems incorporating flexible light sheets and related methods
#34 | 2017-01-19Illumination device control systems and methods
#35 | 2016-12-15Arbitrarily sizable broad-area lighting system
#36 | 2016-12-15Lighting systems with removable illumination modules
#37 | 2016-11-10ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
#38 | 2016-11-08Shippable LED-based luminaire
#39 | 2016-10-20Modular LED lighting systems
#40 | 2016-08-18Formation of uniform phosphor regions for broad-area lighting systems
#41 | 2016-08-04Light-emitting dies incorporating wavelength-conversion materials and related methods
#42 | 2016-07-28Systems and methods for recycling electronic systems
#43 | 2016-07-28Systems and methods for patterning composite materials and fabricating illumination systems
#44 | 2016-07-28Methods for adhesive bonding of electronic devices
#45 | 2016-07-28High efficiency LEDs and LED lamps
#46 | 2016-07-28Systems for adhesive bonding of electronic devices
#47 | 2016-07-14Thermal management in electronic devices with yielding substrates
#48 | 2016-07-07Methods for uniform LED lighting
#49 | 2016-07-07SYSTEMS FOR UNIFORM LED LIGHTING
#50 | 2016-06-30Illumination device control systems and methods
#51 | 2016-06-30Illumination device control systems and methods
#52 | 2016-06-09Automated test systems and methods utilizing images to determine locations of non-functional light-emitting elements in light-emitting arrays
#53 | 2016-04-21Electronic devices with yielding substrates
#54 | 2016-04-14ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
#55 | 2016-04-07Light-emitting dies incorporating wavelength-conversion materials and related methods
#56 | 2016-03-24Wafer-level flip chip device packages and related methods
#57 | 2016-03-24Wafer-level flip chip device packages and related methods
#58 | 2016-03-17STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES
#59 | 2016-01-28LED LIGHTING SYSTEM INCORPORATING FOLDED LIGHT SHEETS
#60 | 2016-01-14High efficiency LEDs and LED lamps
#61 | 2015-12-10Engineered-phosphor LED packages and related methods
#62 | 2015-11-19Thermal management in electronic devices with yielding substrates
#63 | 2015-11-12Illumination device control systems and methods
#64 | 2015-10-29Modular LED lighting systems
#65 | 2015-10-29Modular LED lighting systems
#66 | 2015-10-01LED lighting structure
#67 | 2015-08-20Electronic devices with yielding substrates
#68 | 2015-08-06Light-emitting dies incorporating wavelength-conversion materials and related methods
#69 | 2015-08-06Light-emitting dies incorporating wavelength-conversion materials and related methods
#70 | 2015-07-23ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS
#71 | 2015-06-18Engineered-phosphor LED packages and related methods
#72 | 2015-06-11Light-emitting dies incorporating wavelength-conversion materials and related methods
#73 | 2015-04-30Non-linear system control methods
#74 | 2015-04-30High efficiency LEDs and LED lamps
#75 | 2015-04-23Engineered-phosphor LED packages and related methods
#76 | 2015-04-23Wiring boards for array-based electronic devices
#77 | 2015-04-23Wiring boards for array-based electronic devices
#78 | 2015-04-23Wafer-level flip chip device packages and related methods
#79 | 2015-03-19Light-emitting dies incorporating wavelength-conversion materials and related methods
#80 | 2015-03-19Wiring boards for array-based electronic devices
#81 | 2015-03-19Methods of fabricating wafer-level flip chip device packages
#82 | 2015-03-19Polymeric binders incorporating light-detecting elements
#83 | 2015-02-12Failure mitigation in arrays of light-emitting devices
#84 | 2015-02-05CONTROL OF LUMINOUS INTENSITY DISTRIBUTION FROM AN ARRAY OF POINT LIGHT SOURCES
#85 | 2015-01-08Stress relief for array-based electronic devices
#86 | 2015-01-01Electronic devices with yielding substrates
#87 | 2015-01-01FORMATION OF PHOSPHOR REGIONS FOR BROAD-AREA LIGHTING SYSTEMS
#88 | 2014-12-18Lighting systems incorporating flexible light sheets deformable to produce desired light distributions
#89 | 2014-12-18PORTABLE LIGHTING SYSTEMS INCORPORATING DEFORMABLE LIGHT SHEETS
#90 | 2014-12-11Sealed and sealable lighting systems incorporating flexible light sheets and related methods
#91 | 2014-10-30Light-emitting dies incorporating wavelength-conversion materials and related methods
#92 | 2014-10-23Illumination device control systems and methods
#93 | 2014-09-18Thermal management in electronic devices with yielding substrates
#94 | 2014-09-18Light-emitting devices having engineered phosphor elements
#95 | 2014-09-18Stress relief for array-based electronic devices
#96 | 2014-09-18Engineered-phosphor LED packages and related methods
#97 | 2014-09-04Polymeric binders incorporating light-detecting elements and related methods
#98 | 2014-08-21Engineered-phosphor LED packages and related methods
#99 | 2014-08-21Engineered-phosphor LED packages and related methods
#100 | 2014-08-14Discrete phosphor chips for light-emitting devices and related methods
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