München
Germany
43
2023-11-02
The entities that hold a legal rights for patent applications filed by inventor Weidner Karl:
Karl Weidner from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Optoelectronic semiconductor component
#2 | 2022-04-07Optoelectronic semiconductor component
#3 | 2020-08-06Optoelectronic semiconductor component
#4 | 2019-07-25POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE
#5 | 2019-05-30Stacked modules
#6 | 2018-08-30Optoelectronic semiconductor component
#7 | 2017-10-12Optoelectronic semiconductor component
#8 | 2017-01-26Optoelectronic semiconductor component
#9 | 2016-02-25Optoelectronic semiconductor component
#10 | 2015-01-15Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component
#11 | 2014-09-25Optoelectronic semiconductor component
#12 | 2013-10-10Micromechanical substrate for a diaphragm with a diffusion barrier layer
#13 | 2013-08-22Method for producing at least one optoelectronic semiconductor component
#14 | 2013-08-15Radiation-emitting component and method for producing radiation-emitting components
#15 | 2012-09-20Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
#16 | 2012-09-13Optoelectronic Component Having a Semiconductor Body, an Insulating Layer, and a Planar Conductor Structure, and Method for the Production thereof
#17 | 2012-09-06Optoelectronic component and method for producing an opto-electronic component
#18 | 2012-05-31WAVEGUIDE, IN PARTICULAR IN A DIELECTRIC-WALL ACCELERATOR
#19 | 2012-05-17Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
#20 | 2011-11-10Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material
#21 | 2011-05-12Planar electrical power electronic modules for high-temperature applications, and corresponding production methods
#22 | 2010-11-18Strip conductor structure for minimizing thermomechanical loads
#23 | 2010-08-19Method for contacting electronic components by means of a substrate plate
#24 | 2010-07-29Method and apparatus for manufacturing an electronic module, and electronic module
#25 | 2010-06-03Method for producing electronic component and electronic component
#26 | 2010-04-15Arrangement for hermetically sealing components, and method for the production thereof
#27 | 2009-04-30Hardware Protection System For Deep-Drawn Printed Circuit Boards, As Half-Shells
#28 | 2009-01-29Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
#29 | 2009-01-22Method for making contact with a contact surface on a substrate
#30 | 2008-08-14Adhesive Strip Conductor on an Insulating Layer
#31 | 2008-07-10Strip Conductor Structure for Minimizing Thermomechanical Loads
#32 | 2008-06-05Producing SiC packs on a wafer plane
#33 | 2008-05-29Envelopment of Components Arranged on a Substrate
#34 | 2008-04-24Metallised film for sheet contacting
#35 | 2008-01-17Method for producing a dielectric layer for an electronic component
#36 | 2007-09-20Device having a contacting structure
#37 | 2007-08-16Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
#38 | 2007-08-02Electrical component on a substrate and method for production thereof
#39 | 2006-11-09Method of manufacturing a device having a contacting structure
#40 | 2006-11-09Method of manufacturing self-supporting contacting structures
#41 | 2006-09-07Arrangement of an electrical component placed on a substrate, and method for producing the same
#42 | 2006-08-31Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours
#43 | 2005-02-10Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces
384766 ⎘