Stephen R. Hooper

Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE

Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof

Microelectronic packages having split gyroscope structures and methods for the fabrication thereof

Sensing field effect transistor devices and method of their manufacture

Microelectronic packages having hermetic cavities and methods for the production thereof

STRESS ISOLATED MEMS DEVICE WITH ASIC AS CAP

Environmental sensor structure

Stress isolation for MEMS device

Differential pressure sensor assembly

Sensor protective coating

Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication

Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

Sequential wafer bonding

Sensor package having stacked die

Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof

Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

Semiconductor device package and method of manufacture

Shielding MEMS structures during wafer dicing

Sensor protective coating

Vent hole sealing in multiple die sensor device

Sensor device packages and related fabrication methods

Cavity-type semiconductor package and method of packaging same

Sequential wafer bonding

SENSOR PACKAGE AND METHOD OF FORMING SAME

Semiconductor device package and method of manufacture

Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture

Sensor packaging method and sensor packages

Sensor packaging method and sensor packages

Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture

Sensor package and method of forming same

Semiconductor device package and method of manufacture

Cavity-type semiconductor package and method of packaging same

Tester and method for testing a strip of devices

Integrated circuit package and method of forming the same

Method and apparatus for high pressure sensor device

Dual port pressure sensor

Method of making a dual port pressure sensor

Methods for fabricating sensor device package using a sealing structure

Sensor device with sealing structure

Device including an antenna and method of using an antenna

Molded differential PRT pressure sensor

Exposed pad backside pressure sensor package

Integrated circuit encapsulation and method therefor

Leadframe for packaged electronic device with enhanced mold locking capability

Capacitor assembly with shielded connections and method for forming the same

Integrated circuit encapsulation and method therefor

Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level

Method of making a substrate contact for a capped MEMS at the package level

Methods and apparatus having wafer level chip scale package for sensing elements