SOITEC

City:

Country:

United States

Published Applications:

Last publication date:

2013-08-29

Top Assignees for applications by SOITEC

The entities that hold a legal rights for patent applications filed by inventor SOITEC:

SOITEC from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Metallic carrier for layer transfer and methods for forming the same

Method for molecular adhesion bonding with compensation for radial misalignment

Process for fabricating a silicon-on-insulator structure

InventorID:

384915 ⎘