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Inventor profile of:

Wen Chu

City:

Country:

United States

Published Applications:

1

Last publication date:

2013-08-15

Recent patent applications by Chu Wen

Wen Chu from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-08-15

US20130207266A1

Copper Interconnect for III-V Compound Semiconductor Devices

InventorID:

384961 ⎘