Madison, Wisconsin
United States
17
2015-08-06
The entities that hold a legal rights for patent applications filed by inventor Yu Cheeman:
Cheeman Yu from Madison, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Printed circuit board with coextensive electrical connectors and contact pad areas
#2 | 2015-02-26Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#3 | 2013-11-14Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#4 | 2013-08-15Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#5 | 2012-06-28Hidden plating traces
#6 | 2012-02-02Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#7 | 2011-12-29Corrugated die edge for stacked die semiconductor package
#8 | 2010-11-18Semiconductor die having a redistribution layer
#9 | 2010-10-07Method of fabricating a two-sided die in a four-sided leadframe based package
#10 | 2010-10-07Printed circuit board with coextensive electrical connectors and contact pad areas
#11 | 2010-04-29High density three dimensional semiconductor die package
#12 | 2010-03-04Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
#13 | 2010-03-04Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#14 | 2010-03-04Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#15 | 2010-03-04Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
#16 | 2009-10-22Hidden plating traces
#17 | 2009-10-15Stacked, interconnected semiconductor package
384974 ⎘