William John Boardman

City:

Danville, California

Country:

United States

Published Applications:

Last publication date:

2009-01-15

Top Assignees for applications by William John Boardman

The entities that hold a legal rights for patent applications filed by inventor Boardman William John:

Sub-One Technology, Inc. 2 Pleasanton, CA United States

Recent patent applications by Boardman William John

William John Boardman from Danville, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-01-15

US20090017222A1

Chemistry; metallurgy

Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films

#2 | 2008-02-07

US20080029494A1

Chemistry; metallurgy

System and method for treating surfaces of components

InventorID:

3857017 ⎘