Parrish, Florida
United States
26
2014-10-02
The entities that hold a legal rights for patent applications filed by inventor Dalzell William J.:
William J. Dalzell from Parrish, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Fibrous laminate interface for security coatings
#2 | 2014-05-29Tamper-resistant coating for an integrated circuit
#3 | 2013-08-15Protecting packages from tampering
#4 | 2012-08-02DATA PROTECTION WHEN A MONITOR DEVICE FAILS OR IS ATTACKED
#5 | 2012-03-22TAMPER EVENT DETECTION
#6 | 2012-03-01Printed board assembly movement detection
#7 | 2011-01-06Method and apparatus for erasure of data from a data storage device located on a vehicle
#8 | 2008-09-18Fibrous laminate interface for security coatings
#9 | 2008-08-14Methods and systems for recognizing tamper events
#10 | 2008-06-05Card slot anti-tamper protection system
#11 | 2008-06-05Secure connector with integrated tamper sensors
#12 | 2008-06-05SECURE CHASSIS WITH INTEGRATED TAMPER DETECTION SENSOR
#13 | 2008-03-27Anti-tamper enclosure system comprising a photosensitive sensor and optical medium
#14 | 2008-01-10Thermally conductive composite and uses for microelectronic packaging
#15 | 2007-12-06COMFORMAL COVERINGS FOR ELECTRONIC DEVICES
#16 | 2007-07-26Connector ports for anti-tamper
#17 | 2007-07-05Method and system to detect tampering using light detector
#18 | 2007-05-17Method and system to detect tampering of a closed chassis using a passive fiber optic sensor
#19 | 2007-03-08Medical devices incorporating radio-opaque and biocompatible coatings
#20 | 2007-03-01Conformal coverings for electronic devices
#21 | 2007-02-22Hardware key control of debug interface
#22 | 2007-01-18Security techniques for electronic devices
#23 | 2006-11-16System and method for non-destructively determining thickness and uniformity of anti-tamper coatings
#24 | 2006-10-26Hardware encryption key for use in anti-tamper system
#25 | 2006-10-26Encrypted JTAG interface
#26 | 2006-03-30Thermally conductive composite and uses for microelectronic packaging
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