Phillip E. Thompson

City:

Springfield, Virginia

Country:

United States

Published Applications:

Last publication date:

2009-01-22

Top Assignees for applications by Phillip E. Thompson

The entities that hold a legal rights for patent applications filed by inventor Thompson Phillip E.:

THE OHIO STATE UNIVERSITY 3 Columbus, OH United States
The United States of America, as represented by the Secretary of the Navy 2 Washington, DC United States
THE OHIO STATE UNIVERSITY RESEARCH FOUNDATION 1 Columbus, OH United States

Recent patent applications by Thompson Phillip E.

Phillip E. Thompson from Springfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-01-22

US20090020748A1

Electricity

Si/SiGe interband tunneling diodes with tensile strain

#2 | 2007-12-04

US9934334

Method of making interband tunneling diodes

#3 | 2007-11-20

US10903442

Si/SiGe interband tunneling diode structures including SiGe diffusion barriers

#4 | 2006-12-21

US20060284165A1

Electricity

Silicon-based backward diodes for zero-biased square law detection and detector arrays of same

#5 | 2006-11-30

US20060270190A1

Electricity

Method of transferring a thin crystalline semiconductor layer

#6 | 2006-10-19

US20060234474A1

Electricity

Method of transferring a thin crystalline semiconductor layer

InventorID:

3860393 ⎘