Jae Heung Lee

City:

Daejun

Country:

South Korea

Published Applications:

Last publication date:

2009-01-22

Top Assignees for applications by Jae Heung Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Jae Heung:

Korea Research Institute of Chemical Technology 1 Ysung-gu , Daejun, South Korea
Korea Research Institute of Chemical Technology 1 Yusung-gu, Daejun, South Korea

Recent patent applications by Lee Jae Heung

Jae Heung Lee from Daejun, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-01-22

US20090023010A1

Electricity

Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby

InventorID:

3862258 ⎘