Brian E. Bottema

City:

Austin, Texas

Country:

United States

Published Applications:

Last publication date:

2009-01-22

Top Assignees for applications by Brian E. Bottema

The entities that hold a legal rights for patent applications filed by inventor Bottema Brian E.:

Brian E. Bottema from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Process of using a polishing apparatus including a platen window and a polishing pad

Polishing pad, a polishing apparatus, and a process for using the polishing pad

Platen endpoint window with pressure relief

Grooved platen with channels or pathway to ambient air

Polishing pad, a polishing apparatus, and a process for using the polishing pad

Polishing carrier head with a modified pressure profile

Polishing system having a carrier head with substrate presence sensing

Chemical mechanical polish (CMP) conditioning-disk holder

InventorID:

3862619 ⎘