Inventor profile of:

John U. Knickerbocker

City:

Wappingers Falls, New York

Country:

United States

Published Applications:

19

Last publication date:

2014-12-16

Top Assignees for applications by John U. Knickerbocker

The entities that hold a legal rights for patent applications filed by inventor Knickerbocker John U.:

Recent patent applications by Knickerbocker John U.

John U. Knickerbocker from Wappingers Falls, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-16
US10880289
Physics

Manufacturable optical connection assemblies

#2 | 2009-02-05
US20090032962A1
Electricity

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

#3 | 2008-09-25
US20080231311A1
Electricity

Physically highly secure multi-chip assembly

#4 | 2008-07-31
US20080182359A1
Electricity

Techniques for providing decoupling capacitance

#5 | 2008-03-25
US11625449
-

Techniques for forming interconnects

#6 | 2008-01-10
US20080009101A1
Electricity

Compressible films surrounding solder connectors

#7 | 2008-01-03
US20080000080A1
Electricity

COMPLIANT ELECTRICAL CONTACTS

#8 | 2007-11-01
US20070252288A1
Electricity

SEMICONDUCTOR MODULE AND METHOD FOR FORMING THE SAME

#9 | 2007-06-21
US20070138657A1
Electricity

Physically highly secure multi-chip assembly

#10 | 2007-04-19
US20070084629A1
Electricity

Low stress conductive polymer bump

#11 | 2006-09-21
US20060211167A1
Electricity

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

#12 | 2006-08-10
US20060177568A1
Electricity

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

#13 | 2006-08-03
US20060172565A1
Electricity

Compliant electrical contacts

#14 | 2006-03-02
US20060043608A1
Electricity

Low stress conductive polymer bump

#15 | 2006-02-23
US20060040567A1
Electricity

Compressible films surrounding solder connectors

#16 | 2005-10-18
US10338093
-

Method of forming a plate for dispensing chemicals

#17 | 2005-07-14
US20050152650A1
Physics

Method and structure for two-dimensional optical fiber ferrule

#18 | 2005-05-26
US20050110160A1
Electricity

Semiconductor module with improved interposer structure and method for forming the same

#19 | 2005-04-14
US20050077657A1
Performing operations; transporting

A Method of Making a Multichannel and Multilayer Pharmaceutical Device

InventorID:

3871117 ⎘