RICHARD J. MARKLE

Method and apparatus for modifying process selectivities based on process state information

Method and apparatus for dynamically determining tester recipes

Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities

Method and apparatus for dynamic adjustment of a sampling plan based on wafer electrical test data

Plasma state monitoring to control etching processes and across-wafer uniformity, and system for performing same

Method and apparatus for coordinating fault detection settings and process control changes

Method and apparatus for fault detection classification of multiple tools based upon external data

Total tool control for semiconductor manufacturing

Automated integrated circuit device manufacturing facility using distributed control

Method and apparatus for determining grid dimensions using scatterometry

Automated integrated circuit device manufacturing facility using central control

Secondary process controller for supplementing a primary process controller

Method and apparatus for calibrating degradable components using process state data

Method and apparatus for fault classification based on residual vectors

Conflict resolution among multiple controllers

Method and system for calibrating integrated metrology systems and stand-alone metrology systems that acquire wafer state data

Fault detection spanning multiple processes

Verifying a fault detection result based on a process control state

Process control based on an estimated process result

Method and apparatus for modifying design constraints based on observed performance

Fault detection and control methodologies for ion implantation processes, and system for performing same

Method and apparatus for determining electromagnetic properties of a process layer using scatterometry measurements