Lake Forest, California
United States
3
2009-03-19
Robert J. Rapp from Lake Forest, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe
#2 | 2006-12-07Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe
#3 | 2006-12-073 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized
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