David Sun

Manufacturing method for partially-good memory modules with defect table in EEPROM

Repairing advanced-memory buffer (AMB) with redundant memory buffer for repairing DRAM on a fully-buffered memory-module

Repairing Advanced-Memory Buffer (AMB) with redundant memory buffer for repairing DRAM on a fully-buffered memory-module

Testing DRAM chips with a PC motherboard attached to a chip handler by a solder-side adaptor board with an advanced-memory buffer (AMB)

Fully-buffered memory-module with error-correction code (ECC) controller in serializing advanced-memory buffer (AMB) that is transparent to motherboard memory controller

Fully-buffered memory-module with redundant memory buffer in serializing advanced-memory buffer (AMB) for repairing DRAM

Memory-module manufacturing method with memory-chip burn-in and full functional testing delayed until module burn-in

Memory module with a defective memory chip having defective blocks disabled by non-multiplexed address lines to the defective chip

Efficient air-flow loop through dual burn-in chambers with removable pattern-generator boards for memory-module environmental testing

Sliding levered handles engaging and pushing memory modules into extender-card socket

Extender card for testing error-correction-code (ECC) storage area on memory modules

Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane