Shinya NISHIMURA

City:

Sakura-shi

Country:

Japan

Published Applications:

Last publication date:

2009-03-26

Top Assignees for applications by Shinya NISHIMURA

The entities that hold a legal rights for patent applications filed by inventor NISHIMURA Shinya:

FUJIKURA LTD. 2 Tokyo, Japan
TOKYO INSTITUTE OF TECHNOLOGY 2 Tokyo, Japan

Recent patent applications by NISHIMURA Shinya

Shinya NISHIMURA from Sakura-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-03-26

US20090082543A1

Chemistry; metallurgy

METHOD OF PREPARING POLY(AMIC ACID) AND METHOD OF PREPARING POLYIMIDE

#2 | 2009-03-26

US20090078368A1

Chemistry; metallurgy

METHOD OF PRODUCING COPPER-CLAD LAMINATE, METHOD OF PRODUCING COVERLAY, AND METHOD OF PRODUCING FLEXIBLE PRINTED CIRCUIT BOARD

InventorID:

3909073 ⎘