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Inventor profile of:

Mark E. Webster

City:

Kokomo, Indiana

Country:

United States

Published Applications:

1

Last publication date:

2009-03-26

Recent patent applications by Webster Mark E.

Mark E. Webster from Kokomo, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-03-26

US20090080169A1

Method for forming BGA package with increased standoff height

InventorID:

3910531 ⎘