Robert L.D. Zenner

City:

Minneapolis, Minnesota

Country:

United States

Published Applications:

Last publication date:

2009-06-18

Top Assignees for applications by Robert L.D. Zenner

The entities that hold a legal rights for patent applications filed by inventor Zenner Robert L.D.:

3M INNOVATIVE PROPERTIES COMPANY 1 St. Paul, MN United States

Recent patent applications by Zenner Robert L.D.

Robert L.D. Zenner from Minneapolis, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-06-18

US20090155597A1

Electricity

CONDUCTIVE ADHESIVE PRECURSOR, METHOD OF USING THE SAME, AND ARTICLE

#2 | 2009-04-02

US20090087591A1

Electricity

Low temperature bonding electronic adhesives

#3 | 2007-09-20

US20070219285A1

Chemistry; metallurgy

UV B-STAGEABLE, MOISTURE CURABLE COMPOSITION USEFUL FOR RAPID ELECTRONIC DEVICE ASSEMBLY

#4 | 2007-05-10

US20070102827A1

Electricity

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

InventorID:

3916288 ⎘