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Inventor profile of:

Eisuke Niiyama

City:

Ibaraki

Country:

Japan

Published Applications:

1

Last publication date:

2009-04-16

Recent patent applications by Niiyama Eisuke

Eisuke Niiyama from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-04-16

US20090095434A1

Chemistry; metallurgy

Method for preparing semi-solid metal slurry, molding method, and molded product

InventorID:

3922514 ⎘