Robert M. Duboc

City:

Menlo Park, California

Country:

United States

Published Applications:

Last publication date:

2009-04-16

Top Assignees for applications by Robert M. Duboc

The entities that hold a legal rights for patent applications filed by inventor Duboc Robert M.:

Robert M. Duboc from Menlo Park, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Low cost hermetically sealed package

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Low cost hermetically sealed package

Electrical connections in microelectromechanical devices

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Multi-step turn off mode for projection display

InventorID:

3925124 ⎘