Daniel A. Wilson

City:

Cincinnati, Ohio

Country:

United States

Published Applications:

Last publication date:

2009-04-16

Top Assignees for applications by Daniel A. Wilson

The entities that hold a legal rights for patent applications filed by inventor Wilson Daniel A.:

HEXION SPECIALTY CHEMICALS, INC. 1 Columbus, OH United States

Recent patent applications by Wilson Daniel A.

Daniel A. Wilson from Cincinnati, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-04-16

US20090099277A1

Chemistry; metallurgy

Radiation curable and jettable ink compositions

#2 | 2008-04-17

US20080090929A1

Chemistry; metallurgy

Ink compositions and methods of use thereof

#3 | 2008-02-05

US10607514

Optical fiber ribbons containing radiation cured encapsulating materials

InventorID:

3925568 ⎘