Hsinchu
Taiwan
5
2009-04-30
The entities that hold a legal rights for patent applications filed by inventor Lin Kuo-Wei:
Kuo-Wei Lin from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Colors only process to reduce package yield loss
#2 | 2007-05-31Colors only process to reduce package yield loss
#3 | 2005-10-25Method for dual-layer polyimide processing on bumping technology
#4 | 2005-10-18Bumping process to increase bump height and to create a more robust bump structure
#5 | 2005-04-05Colors only process to reduce package yield loss
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